Wire Wound > SMD Inductors

SPI Series
Feature:
*Lowest height in this package footprint.*Shielded construction.
*Lowest DCR/uH, in this package size.
*Ultra low buzz noise, due to composite construction.
Application :
*DC/DC converter for CPU in PDA/ notebook/ desktop/server applications.*Thin type on-board power supply module for exchanger.
*DC/DC converter in distributed power systems.